High performance design automation for multi-chip modules and packages / editor, Jun-Dong Cho ; co-editor, Paul D. Franzon



Digitised Book 3.143.212.252 (0)

1996

High performance design automation for multi-chip modules and packages / editor, Jun-Dong Cho ; co-editor, Paul D. Franzon

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Information About

The concept of Multi-Chip Modules (MCM) was developed for packaging high speed systems. Today's electronics industry requires new design automation tools and design methodologies that allow designers to concurrently design high performance integrated circuits and high performance packaging. The purpose of this book is to investigate recent developments in algorithm design and combinatorial structures to High Performance Design Automation of MCMs.

Subjects

Electronic packaging--Design--Data processing Multichip modules (Microelectronics)--Design--Data processing Computer-aided design

Categories

Electronics industry Science and technology

Additional Details

Subject
Electronic packaging--Design--Data processing
Multichip modules (Microelectronics)--Design--Data processing
Computer-aided design
Publisher
World Scientific, 1996
National Library Board Singapore, 1996
Contributors
Cho, Jun-Dong
Franzon, Paul D.
Digital Description
application/pdf, ill.
Table of Contents
pt. 1. Physical design optimization for MCMs. An overview of placement and routing algorithms for multi-chip modules. Early feasibility and cost assessment for multichip module technologies... -- pt. 2. Other MCM and package design optimizations. An overview of techniques for partitioning multichip modules. Interconnect design and synthesis in high speed printed circuit boards and multi-chip modules...
Copyright
All Rights Reserved. National Library Board Singapore 2009.